Electrochemical migration of Sn and Sn solder alloys: a review-Reference-Cited by-同舟云学术

Electrochemical migration of Sn and Sn solder alloys: a review

Author:

Zhong Xiankang¹²³⁴⁵^ORCID,Chen Longjun¹²³⁴⁵,Medgyes Bálint⁶⁷⁸⁹,Zhang Zhi¹²³⁴⁵,Gao Shujun¹⁰¹¹¹²¹³,Jakab László⁶⁷⁸⁹

Affiliation:

1. State Key Laboratory of Oil and Gas Reservoir Geology and Exploitation

2. School of Oil and Natural Gas Engineering

3. Southwest Petroleum University

4. Chengdu 610500

5. P. R. China

6. Department of Electronics Technology

7. Budapest University of Technology and Economics

8. Budapest H-1111

9. Hungary

10. Department of Chemical & Biomolecular Engineering

11. Ohio University

12. OH 45701

13. USA

Abstract

The schematic diagram of electrochemical migration of Sn solder alloys joints.

Funder

Alexander von Humboldt-Stiftung

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

Reference157 articles.

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