A DEVICE-LEVEL COMPACT THERMAL MODEL FOR FAST PREDICTING THE SKIN TEMPERATURE OF LAPTOPS
Author:
Liu Haoran,Wang Ru-Zhu
Reference20 articles.
1. R. van Erp, R. Soleimanzadeh, L. Nela, G. Kampitsis, and E. Matioli, 'Co-designing electronics with microfluidics for more sustainable cooling,' Nature, vol. 585, no. 7824, pp. 211-216, Sep 2020. 2. Y. H. a. H. Kabban, 'Thermal management in mobile devices: challenges and solutions,' 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), pp. 46-49, 2015. 3. H. R. Liu, L. J. Hua, B. J. Li, C. X. Wang, and R. Z. Wang, 'Thermal resistance-capacitance network model for fast simulation on the desiccant coated devices used for effective electronic cooling,' International Journal of Refrigeration, vol. 131, pp. 78-86, 2021. 4. H. Wei, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, and M. R. Stan, 'HotSpot: a compact thermal modeling methodology for early-stage VLSI design,' IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 14, no. 5, pp. 501-513, 2006. 5. C. J. M. Lasance, 'Ten Years of Boundary-Condition-Independent Compact Thermal Modeling of Electronic Parts: A Review,' Heat Transfer Engineering, vol. 29, no. 2, pp. 149-168, 2010.
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