Author:
El Arabi Ali,Blet Nicolas,Remy Benjamin,Maillet Denis
Reference13 articles.
1. A.Intrich, U. Nicolai, W. Trsky and T. Reinmann, Application Manual Power Semiconductors, 2010.
2. G. Bower, P. Rogan and J. K. a. M. Zugger, 'SiC power electronics packaging pronostics,' IEEE Aerospaceconference,, 2008..
3. D. Othman, S. Lefebvre, M. Berkani, Z. Katir, A. Ibrahim and and A. Bouzourene, 'Investigation of 1.2 kV SiCMOSFET for Aeronautics Applications,' 15th European Conference on Power Electronics and Applications, 2013.
4. D. Maillet, S. Andre, J.-C. Batsale, A. Degiovanni and C. Moyne, Thermal quadrupoles : Solving the heat equation through integral transforms, Wiley, 2000.
5. G. Maranzana, I. Perry and D. Maillet, Quasi-analytical simulation of conduction heat transfer through a pyramidal multilayer multiblock by the quadrupole method,' Numerical Heat Transfer, Part B: Fundamentals: An International Journal of Computation and Methodology., pp. 499-521, 2002.