Copper Filling of Deep Sub-µm Through-Holes by High-Vacuum Planar Magnetron Sputtering Using Argon Gas with Added Nitrogen: Optimum Quantity of Nitrogen in Argon Gas-Reference-Cited by-同舟云学术

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Copper Filling of Deep Sub-µm Through-Holes by High-Vacuum Planar Magnetron Sputtering Using Argon Gas with Added Nitrogen: Optimum Quantity of Nitrogen in Argon Gas

Published:2006-02-08 Issue:2A Volume:45 Page:736-738
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Saito Shigeru,Uhara Yoshio,Uenosono Takahide,Nagata Jyunichi,Oyama Minemasa,Nozue Masanori,Miura Tsutomu,Soumura Tetsuo,Kioka Toshihide

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sugar-metal ion interactions: The coordination behavior of cesium ion with lactose, d-arabinose and l-arabinose;Journal of Molecular Structure;2016-04

2. Cu filling of 10 nm trenches by high-magnetic-field magnetron sputtering;Japanese Journal of Applied Physics;2014-04-16

3. Copper Filling of Deep Submicrometer Trenches with Ruthenium-Lined Barrier Metal by High-Vacuum Magnetron Sputtering Using Argon Gas with Added Oxygen;Japanese Journal of Applied Physics;2012-02-01

4. Copper Filling of Deep Submicrometer Trenches with Ruthenium-Lined Barrier Metal by High-Vacuum Magnetron Sputtering Using Argon Gas with Added Oxygen;Japanese Journal of Applied Physics;2012-01-13

5. Copper filling of deep sub-μm through-holes by high-vacuum planar magnetron sputtering using argon gas with added oxygen;Applied Surface Science;2009-11

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