Statistical Analysis of Lifetime Distribution of Time-Dependent Dielectric Breakdown in Cu/Low-kInterconnects by Incorporation of Overlay Error Model
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference6 articles.
1. Dominant Factors in TDDB Degradation of Cu Interconnects
2. Reliability analysis method for low-k interconnect dielectrics breakdown in integrated circuits
3. Simple model for time-dependent dielectric breakdown in inter- and intralevel low-k dielectrics
4. Addressing Cu/Low-$k$ Dielectric TDDB-Reliability Challenges for Advanced CMOS Technologies
5. Time-Dependent Dielectric Breakdown Characterization of 90- and 65-nm-Node Cu/SiOC Interconnects with Via Plugs
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1. Applications of lifetime distribution functions with two shape parameters for reliability analysis in advanced interconnect technologies: a brief review;Japanese Journal of Applied Physics;2020-04-01
2. Bayesian inference of a lifetime distribution parameter on the time-dependent dielectric breakdown with clustering defects;Japanese Journal of Applied Physics;2019-07-01
3. Statistical evaluation method for lifetime distribution in field-accelerated time-dependent dielectric breakdown using two-step probability plot and multilink test scheme;Japanese Journal of Applied Physics;2018-05-21
4. Survey of critical failure events in on-chip interconnect by fault tree analysis;Japanese Journal of Applied Physics;2018-05-21
5. Two-step probability plot for parameter estimation of lifetime distribution affected by defect clustering in time-dependent dielectric breakdown;Japanese Journal of Applied Physics;2017-06-21
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