Addressing Cu/Low-$k$ Dielectric TDDB-Reliability Challenges for Advanced CMOS Technologies-Reference-Cited by-同舟云学术

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Addressing Cu/Low-$k$ Dielectric TDDB-Reliability Challenges for Advanced CMOS Technologies

Published:2009-01 Issue:1 Volume:56 Page:2-12
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Chen Fen,Shinosky Mike

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/4723893/04717239.pdf?arnumber=4717239

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