Silicon Micromachining Based on Surfactant-Added Tetramethyl Ammonium Hydroxide: Etching Mechanism and Advanced Applications
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference32 articles.
1. Effect of Temperature on the Interaction of Silicon with Nonionic Surfactants in Alkaline Solutions
2. Effect of surfactant on surface quality of silicon microstructures etched in saturated TMAHW solutions
3. Study on anisotropic silicon etching characteristics in various surfactant-added tetramethyl ammonium hydroxide water solutions
4. The role of Triton surfactant in anisotropic etching of {1 1 0} reflective planes on (1 0 0) silicon
5. Study of rounded concave and sharp edge convex corners undercutting in CMOS compatible anisotropic etchants
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