Highly Selective Dry Etching of GaN over AlGaN Using Inductively Coupled Cl2/N2/O2Plasmas
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/42/i=10A/a=L1139/pdf
Cited by 36 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fluorine-Based Low-Damage Selective Etching Process for E-Mode p-GaN/AlGaN/GaN HFET Fabrication;Electronics;2023-10-20
2. Suppression of Reverse Leakage in Enhancement‐Mode GaN High‐Electron‐Mobility Transistor by Extended PGaN Technology;physica status solidi (a);2023-05-31
3. Use of Laser Interferometry to Determine the End Time of the Plasma-Chemical Etching of p-GaN and AlGaN Layers of the p-GaN/AlGaN/GaN Heterostructure with Two-Dimensional Electron Gas;Doklady BGUIR;2022-12-09
4. Performance improvement in NiO x -based GaN MOS-HEMTs;Semiconductor Science and Technology;2022-06-21
5. Removal of GaN film over AlGaN with inductively coupled BCl3/Ar atomic layer etch;Chinese Physics B;2022-01-01
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