Enhancement of Dry-Etching Durabilities by Energy or Etchant Quenching-Reference-Cited by-同舟云学术

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Enhancement of Dry-Etching Durabilities by Energy or Etchant Quenching

Published:1999-07-30 Issue:Part 1, No. 7B Volume:38 Page:4483-4487
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kawata Hiroaki,Fukuda Hiroyoshi,Matsunaga Takashi,Yasuda Masaaki,Murata Kenji

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Etch considerations for directed self-assembly patterning using capacitively coupled plasma;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2018-05

2. Novel ArF photoresist polymer to suppress the formation of roughness in plasma etching processes;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2013-11

3. Novel ArF photoresist polymer to suppress the roughness formation in plasma etching processes;SPIE Proceedings;2013-03-29

4. Construction of polymer skeletons with radiation-scissile groups at predetermined sites;Journal of Polymer Science Part A: Polymer Chemistry;2008

5. Investigation of the drastic change in the sputter rate of polymers at low ion fluence;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2005-07

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