Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference20 articles.
1. High-temperature electronics - a role for wide bandgap semiconductors?
2. SiC power-switching devices-the second electronics revolution?
3. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material
4. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly
5. Study of Bonding Technology Using Silver Nanoparticles
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