Solid-Phase Reactions in Al Alloy/TiN/Ti/Si Systems Observed by In Situ Cross-Sectional TEM-Reference-Cited by-同舟云学术

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Solid-Phase Reactions in Al Alloy/TiN/Ti/Si Systems Observed by In Situ Cross-Sectional TEM

Published:1995-02-28 Issue:Part 1, No. 2B Volume:34 Page:987-991
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Sobue Susumu,Mukainakano Shinichi,Ueno Yoshiki,Hattori Tadashi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of TiNxinter/outer layer on Ag(Cr) thin films at elevated temperatures for low emissivity applications;Japanese Journal of Applied Physics;2014-07-14

2. Titanium nitride diffusion barrier for copper metallization on gallium arsenide;Thin Solid Films;2003-11

3. Failure mechanism of a multilayer (TiN/Al/TiN) diffusion barrier between copper and silicon;Journal of Applied Physics;2002-11

4. A study of the failure mechanism of a titanium nitride diffusion barrier;Journal of Applied Physics;1999-09-15

5. Study on ta diffusion barrier in Al/Si system;Journal of Electronic Materials;1999-01

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