Density Functional Theory Study of Cu Adhesion on Rh, Ir, Pd, Ta, Mo, Ru, Co, and Os Surfaces-Reference-Cited by-同舟云学术

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Density Functional Theory Study of Cu Adhesion on Rh, Ir, Pd, Ta, Mo, Ru, Co, and Os Surfaces

Published:2011-10-20 Issue:10 Volume:50 Page:105701
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Ding Shao-Feng,Lu Hai-Sheng,Chen Fei,Jiang Yu-Long,Ru Guo-Ping,Zhang David Wei,Qu Xin-Ping

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference45 articles.

1. Material Consideration on Ta, Mo, Ru, and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects

2. Recent advances on electromigration in very-large-scale-integration of interconnects

3. Copper metallization reliability

4. Electromigration path in Cu thin-film lines

5. Electromigration in Cu interconnects with very different grain structures

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Incorporation of tungsten or cobalt into TaN barrier layers controls morphology of deposited copper;Journal of Physics: Materials;2023-06-30

2. Ru passivated and Ru doped ε-TaN surfaces as a combined barrier and liner material for copper interconnects: a first principles study;Journal of Materials Chemistry C;2019

3. Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect;Microelectronic Engineering;2016-10

4. Effect of CoxMoyas Single Barrier Layer on Properties of Directly Electroplated Copper Films;Journal of The Electrochemical Society;2016

5. Molecular Dynamics Study on Enhanced Cu Coverage of Trench Filling with Low-Index Ta Surfaces;Japanese Journal of Applied Physics;2012-06-20

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