Improved Heat Treatment for Wafer Direct Bonding between Semiconductors and Magnetic Garnets-Reference-Cited by-同舟云学术

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Improved Heat Treatment for Wafer Direct Bonding between Semiconductors and Magnetic Garnets

Published:1997-05-15 Issue:Part 1, No. 5A Volume:36 Page:2784-2787
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Yokoi Hideki,Mizumoto Tetsuya,Maru Koichi,Naito Yoshiyuki

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On-Chip Nonreciprocal Photonic Devices Based on Hybrid Integration of Magneto-Optical Garnet Thin Films on Silicon;IEEE Journal of Selected Topics in Quantum Electronics;2022-05

2. Recent advances in development of magnetic garnet thin films for applications in spintronics and photonics;Journal of Alloys and Compounds;2021-04

3. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics;Proceedings of the IEEE;2006-12

4. Integration of optical isolators and semiconductor lasers by wafer bonding;SPIE Proceedings;2006-09-22

5. Probing Interface Structure of Low-Temperature-Bonded InP on Si;Electrochemical and Solid-State Letters;2005-05-01

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