Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics-Reference-Cited by-同舟云学术

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Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

Published:2006-12 Issue:12 Volume:94 Page:2060-2106
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Christiansen S.H.,Singh R.,Gosele U.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/5/4077248/04077250.pdf?arnumber=4077250

Cited by 137 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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