Effects of Ag Addition on the Resistivity, Texture and Surface Morphology of Cu Metallization-Reference-Cited by-同舟云学术

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Effects of Ag Addition on the Resistivity, Texture and Surface Morphology of Cu Metallization

Published:2005-09-30 Issue:No. 41 Volume:44 Page:L1278-L1281
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Zhao Bin,Kim Hoon,Shimogaki Yukihiro

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages;Compounds;2024-07-08

2. Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects;Journal of Materials Research and Technology;2024-03

3. Replacement of Cu with One-Step Production of CuAg (Ag0.04Cu3.96): Superior Conductivity, Corrosion Resistance, and Hardness;Transactions of the Indian Institute of Metals;2023-01-11

4. Combinatorial Synthesis and Characterization of Cu-Ag Alloys Using Thin Film Tensile-Test Structures;SSRN Electronic Journal;2022

5. Solid-state dewetting instability in thermally-stable nanocrystalline binary alloys;Materialia;2020-03

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