Author:
Arigela Viswanadh Gowtham,Oellers Tobias,Jeong Jiwon,Salomon S.,Pfetzing-Micklich Janine,Kirchlechner Christoph,Dehm Gerhard,Ludwig Alfred
Subject
General Earth and Planetary Sciences,General Environmental Science
Reference35 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects;K N Tu;Journal of Applied Physics,2003
2. Electromigration and mechanical stress;J R Lloyd;Microelectronic Engineering,1999
3. Physical metallurgy of electromigration: Failure mechanisms in miniaturized conductor lines;E Arzt;Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques,1996
4. On the Possibility of Formation and Properties of Copper-Silver Solid Solutions Under Severe Plastic Deformation;V P Pilyugin;Russian Physics Journal,2016
5. Morphology evolution of two-phase Cu-Ag alloys under different conditions;J.-L Hu;Journal of Zhejiang University-SCIENCE A,2009