System-on-Package Platform with Thick Benzocyclobutene Layer for Millimeter-Wave Antenna Application
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference24 articles.
1. 3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology
2. A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate With a Flip-Chip Interconnection
3. Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology
4. Package-Level Integrated Antennas Based on LTCC Technology
5. Embedded Decoupling Capacitors up to 80 nF on Multichip Module-Deposited with Quasi-Three-Dimensional Metal–Insulator–Metal Structure
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Comparative Study of E-Beam Deposited Gate Dielectrics on Channel Width-Dependent Performance and Reliability of a-IGZO Thin-Film Transistors;Materials;2018-12-09
2. BCB-Si Based Wide Band Millimeter Wave Antenna Fed by Substrate Integrated Waveguide;International Journal of Antennas and Propagation;2013
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