Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon-Reference-Cited by-同舟云学术

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Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon

Published:2012-06-20 Issue: Volume:51 Page:071301
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Venkatesh R. Prasanna,Prasad Y. Nagendra,Kwon Tae-Young,Kang Young-Jae,Park Jin-Goo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect and Mechanism of Dual-Official Group of Ethanolamines on the Chemical Mechanical Polishing of Monocrystalline Silicon;ECS Journal of Solid State Science and Technology;2022-09-01

2. Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution;Tribology International;2020-08

3. Simple method to measure the etching rate of monocrystalline silicon in KOH solution;Micro & Nano Letters;2018-04

4. Why are astigmatic surfaces obtained when machines designed for fabricating surfaces with rotational symmetry are used? Experimental results and analysis;Journal of Optical Technology;2015-03-01

5. Effect of chemical mechanical treatment on the optoelectronic properties in CMOS image sensor;Korean Journal of Chemical Engineering;2015-01-21

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