Author:
Kwon Myoung Seok,Lee Jeong Yong,Choi Kang-Sik,Han Chul-Hi
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Process effects of copper film over a step etched with a plasma-based process;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-03
2. Surface Reactions in Microelectronics Process Technology;Annual Review of Chemical and Biomolecular Engineering;2011-07-15
3. Mechanistic considerations of low temperature hydrogen-based plasma etching of Cu;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-01
4. Temperature Effects and Optical Emission Spectroscopy Studies of Hydrogen-Based Plasma Etching of Copper;Journal of The Electrochemical Society;2011
5. Patterning of Cu Films by a Two-Step Plasma Etching Process at Low Temperature;Journal of The Electrochemical Society;2010