Author:
Wu Fangyu,Levitin Galit,Hess Dennis W.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference38 articles.
1. Lide D. R. , CRC Handbook of Chemistry and Physics, p. 12–41, CRC Press, Boca Raton (2003).
2. Edelstein D. Heidenreich J. Goldblatt R. Cote W. Uzoh C. Lustig N. Roper P. McDevitt T. Motsiff W. Simon A. Dukovic J. Wachnik R. Rathore H. Schulz R. Su L. Luce S. Slattery J. , in Technical Digest., IEEE international Electron Devices Meeting, p. 773. (1997).
3. Resistivity of Copper Films at Thicknesses Near the Mean Free Path of Electrons in Copper Minimization of the Diffuse Scattering in Copper
4. Thickness dependent electrical resistivity of ultrathin (<40 nm) Cu films
5. Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献