Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
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1. Nanostructured TaC film deposited by reactive magnetron sputtering: Influence of gas concentration on structural, mechanical, wear and corrosion properties;Ceramics International;2019-05
2. Vacancy reactions near the interface between electroplated Cu and barrier metal layers studied by monoenergetic positron beams;Journal of Applied Physics;2013-08-21
3. Nondestructive determination of interfacial adhesion property of low-k/Si by the surface acoustic waves;Surface and Coatings Technology;2012-08
4. Evaluating of Adhesion Property of ULSI Interconnect Films by the Surface Acoustic Waves;Chinese Physics Letters;2010-01
5. Effect of plasma treatments on interface adhesion between SiOCH ultra-low-k film and SiCN etch stop layer;Microelectronic Engineering;2008-07
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