Electrochemical Deposition of Nanoscaled Palladium Catalysts for 65 nm Copper Metallization-Reference-Cited by-同舟云学术

Electrochemical Deposition of Nanoscaled Palladium Catalysts for 65 nm Copper Metallization

Published:2003 Issue:9 Volume:150 Page:C603
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Chang Shou-Yi,Hsu Chia-Jung,Fang Ray-Hua,Lin Su-Jien

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. Carbon Nanotubes: Synthesis, Structure, Properties, and Applications, M. S. Dresselhaus, G. Dresselhaus, and P. Avouris, Editors, Springer, New York (2000).

2. Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films

3. Comparison of (hexafluoroacetylacetonate)Cu(vinyltrimethylsilane) and (hexafluoroacetylacetonate)Cu(allyltrimethylsilane) for metalorganic chemical vapor deposition of copper

4. Damascene copper electroplating for chip interconnections

5. Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications

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