Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications-Reference-Cited by-同舟云学术

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Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications

Published:2000-07 Issue:4 Volume:18 Page:1207-1210
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Hu J. C.,Chang T. C.,Wu C. W.,Chen L. J.,Hsiung C. S.,Hsieh W. Y.,Lur W.,Yew T. R.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.582326

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Influence of Leveler on the Impurity Behavior of Electroplated Cu Films During Laser Annealing;Journal of The Electrochemical Society;2021-06-01

2. Effect of Plasma Treatments on the Interface Chemistry and Adhesion Strength Between Cu Metallization and SiCN Etch Stop Layer;Journal of The Electrochemical Society;2007

3. Selective Deposition of Cu Interconnects by Prepatterned Ta Film;Journal of The Electrochemical Society;2006

4. An Ultralow Dielectric Constant Porous Silica Film with Cu Directly Grown by a Displacement Process;Journal of The Electrochemical Society;2006

5. Nanoindentating Mechanical Responses and Interfacial Adhesion Strength of Electrochemically Deposited Copper Film;Journal of The Electrochemical Society;2005

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