Transition of Roughness Evolution in Cu–In Alloy Films by the Formation of Intermetallic Compounds-Reference-Cited by-同舟云学术

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Transition of Roughness Evolution in Cu–In Alloy Films by the Formation of Intermetallic Compounds

Published:2005-04-08 Issue:4A Volume:44 Page:1932-1938
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Nakano Takeo,Mizuhashi Hiroshi,Baba Shigeru

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates;Materials Science and Engineering: A;2019-06

2. Crystal structure determination of a ternary Cu(In,Sn)2intermetallic phase by electron diffraction;Journal of Applied Crystallography;2012-09-13

3. SEM analysis and selenization of Cu–In alloy films produced by co-sputtering of metals;Solar Energy Materials and Solar Cells;2009-01

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