Photoresist Adhesion Effect of Resist Reflow Process
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference3 articles.
1. Resist Reflow Modeling Including Surface Tension and Bulk Effect
2. Cycloolefin copolymer containing hindered hydroxyl group for 193nm photoresist
3. Model-based design improvements for the 100-nm lithography generation
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