Vertically Y-Branched Mode Splitter/Combiner for Intraboard Chip-to-Chip Optical Interconnection with Wavelength-Division Multiplexing-Reference-Cited by-同舟云学术

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Vertically Y-Branched Mode Splitter/Combiner for Intraboard Chip-to-Chip Optical Interconnection with Wavelength-Division Multiplexing

Published:2007-08-23 Issue:8B Volume:46 Page:5499-5503
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kintaka Kenji,Nishii Junji,Yamaguchi Satoshi,Kobayashi Takayuki,Ura Shogo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference21 articles.

1. Linking with light [high-speed optical interconnects]

2. Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems

3. Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies

4. High-density optical interconnects within large-scale systems

5. Passively assembled optical interconnection system based on an optical printed-circuit board

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication for single/few-mode Y-branch waveguide using the Mosquito method;Optics Express;2022-01-19

2. Integrated-Optic Free-Space-Wave Coupler for Package-Level On-Board Optical Interconnects;IEEE Journal of Selected Topics in Quantum Electronics;2011-05

3. Free-space-wave add/drop multiplexing for WDM optical interconnect system in package;SPIE Proceedings;2011-02-10

4. 10.5104/jiep.12.446;Journal of Japan Institute of Electronics Packaging;2009

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