Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx5/2944/27791/01239011.pdf?arnumber=1239011
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