Mid-end Process Technologies for Advanced Packaging of LSI Devices-Reference-Cited by-同舟云学术

Mid-end Process Technologies for Advanced Packaging of LSI Devices

Published:2012 Issue:3 Volume:25 Page:365-370
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Ezawa Hiroaki,Shima Masaya,Migita Tatsuo,Homma Soichi,Miyata Masahiro

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/25/3/25_365/_pdf

Reference6 articles.

1. 1. H.Ezawa, M.Seto, M.Miyata and H. Tazawa, Microelectronics Reliability, 43 (3), 473-479, (2003)

2. 2. M. Brunnbauer, E. F?rgut, G. Beer, T. Meyer, H. Hedler, J. Belonio, E. Nomura, K. Kiuchi, and K. Kobayashi, Proc. 56th Electronic Components and Technology Conference (ECTC2006), 547-551, San Diego, CA, May/June 2006.

3. 3. B. Keser, C. Amrine, T. Duong, O. Fay, S. Hayes, G. Leal, W. Lytle, D. Mitchell and R. Wenzel, Proc.57th Electronic Components and Technology Conference (ECTC2007), 286-291, Reno, NV, May/June 2007.

4. 4. Y. Kikuchi, M. Takahashi, T. Maeda, M. Fukuda, Y. Koshio, H. Hara, H. Arakida, H. Yamamoto, Y. Hagiwara, T. Fujita, M. Watanabe, H. Ezawa, T. Shimazawa, Y. Ohara, T. Miyamori, M. Hamada, M. Takahashi and Y. Oowaki, IEEE J. Solid-State Circuits, 46 (1), 32-41 (2011).

5. 5. H. Ezawa, T. Migita, S. Yamashita, Y. Koshio and M. Fukuda, Proc. Electronics System Integration Technology Conference (ESTC2010), “Process Integration of Fine Pitch Micro-Bumping and Cu Redistribution Wiring for Power Efficient SiP6rdquo;, in Advanced Packaging-2nd Level Interconnect Session, Berlin, Germany, Sept. 2010.

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