Status of EUV Resist and Process Development at IC Manufacture to Implement EUV Lithography to 2X DRAM and Beyond-Reference-Cited by-同舟云学术

Status of EUV Resist and Process Development at IC Manufacture to Implement EUV Lithography to 2X DRAM and Beyond

Published:2011 Issue:2 Volume:24 Page:119-125
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Kim Hyun-Woo,Na Hai-Sub,Park Chang-Min,Park Cheolhong,Kim Sumin,Koh Chawon,Kim In-Sung,Cho Han-Ku

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://www.jstage.jst.go.jp/article/photopolymer/24/2/24_2_119/_pdf

Reference7 articles.

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2. 2. Chawon Koh, Jacque Georger, Liping Ren, George Huang, Frank Goodwin, Stefan Wurm, Dominic Ashworth, and Warren Montgomery, Proc. SPIE 7636 (2010) 763604.

3. 3. Hyun-Woo Kim, Hai-Sub Na, Kyoung-Yong Cho, Chang-Min Park, Takahiro Yasue, Subramanya Mayya, and Han-Ku Cho, Proc. SPIE 7636 (2010) 76360Q.

4. 4. Chawon Koh, Hyun-Woo Kim, Sumin Kim, Chang-Min Park, Hai-Sub Na, Cheolhong Park, and Kyoung-Yong Cho, Hai-Sub Na, Kyoung-Yong Cho, Chang-Min Park, Takahiro Yasue, Subramanya Mayya, and Han-Ku Cho, Proc. SPIE 7969 (2011).

5. 5. Simi A. George, Patrick P. Naulleau, Charles D. Kemp, Paul E. Denham, and Senajith Rekawa, Proc. SPIE 7636 (2010), 763626.

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2. Directed Self Assembly Material Development for Fine Patterning and Pattern Repair;Journal of Photopolymer Science and Technology;2013

3. EUV resist performance: current assessment for sub-22-nm half-pitch patterning on NXE:3300;SPIE Proceedings;2012-03-29

4. Out-of-band insensitive polymer-bound PAG for EUV resist;SPIE Proceedings;2012-03-29

5. Effects of out-of-band radiation on EUV resist performance;SPIE Proceedings;2012-03-29