Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication-Reference-Cited by-同舟云学术

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Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication

Published:2022-12-16 Issue:4 Volume:35 Page:313-319
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Doi Takashi¹,Nishimura Isao¹,Kaneko Masahiro¹,Shimokawa Tsutomu¹

Affiliation:

1. Yokkaichi Research Center, JSR Corporation

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/35/4/35_313/_pdf

Reference22 articles.

1. 1. B. Wang, Y. Jia, H. Zhang, S. Jia, J. Liu, W. Wang, and X. Liu, Proc. SPIE 10513, (2018) 105130Q.

2. 2. E. G. Colgan, B. Furman, M. Gaynes, N. LaBianca, J. Magerlein, R. Polastre, R. J. Benzama, R. Choudhary, K. Marston, H. Toy, J. A. Wakil, and R. Schmidt, HVAC&R Research, 12, (2006) 1031.

3. 3. R. v. Erp, R. Soleimanzadeh, L. Nela, G. Kampitsis, and E. Matioli, Nature, 585 (2020) 211.

4. 4. R. v. Erp, G. Kampitsis, and E. Matioli, 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), (2019) 1383.

5. 5. R. v. Erp, G. Kampitsis, L. Nela, R. S. Ardebili, and E. Matioli, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), (2020) 53.

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