Silicon Microchannel Cooling for High Power Chips-Reference-Cited by-同舟云学术

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Silicon Microchannel Cooling for High Power Chips

Published:2006-10-01 Issue:4 Volume:12 Page:1031-1045
ISSN:1078-9669
Container-title:HVAC&R Research
language:en
Short-container-title:HVAC&R Res.

Author:

Colgan Evan,Furman Bruce,Gaynes Mike,LaBianca Nancy,Magerlein John,Polastre Robert,Bezama R. J.,Choudhary Rehan,Marston Ken,Toy Hilton,Wakil Jamil,Schmidt Roger

Publisher

Informa UK Limited

Subject

Building and Construction

Link

http://www.tandfonline.com/doi/pdf/10.1080/10789669.2006.10391449

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Review of Techniques for Effective Thermal Management in Power Electronics;2024

2. Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication;Journal of Photopolymer Science and Technology;2022-12-16

3. Nonreversible surface relief formation in thin films of cinnamate derivatives containing benzoxazine structure;Journal of Applied Polymer Science;2022-01-21

4. A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-03

5. Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate;International Journal of Heat and Mass Transfer;2015-05

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