Development of Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide with High Elongation
Author:
Affiliation:
1. Electronic & Imaging Materials Research Laboratories, Toray Industries, Inc.
Publisher
Technical Association of Photopolymers, Japan
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Link
https://www.jstage.jst.go.jp/article/photopolymer/29/2/29_277/_pdf
Reference6 articles.
1. 1. J. Azemar, "Fan-Out and Embedded Die: Technologies & Market Trends," Yole Development, Market & Technology Report (2015).
2. 2. A. Cardoso, M. Pires, and R. Pinto, "Thermally Enhanced FOWLP-Development of a Power-eWLB Demonstrator," Proc. IEEE Electronic Components and Technology Conference (ECTC 2015), IEEE press (2015) p1682.
3. 3. Y. Lin, E. Chong, M. Chan, K. H. Lim, and S. W. Yoon, "WLCSP+ and eWLCSP in FlexLine: Innovative Wafer Level Package Manufacturing," Proc. IEEE Electronic Components and Technology Conference (ECTC 2015), IEEE press (2015) p865.
4. 4. B. Singh, V. Smet, J. Lee, G. Menezes, M. Kobayashi, P. M. Raj, V. Sundaram, B. Roggeman, U. Ray, R. Radojcic, and R. Tummala, "First Demonstration of Drop-test Reliability of Ultra-thin Glass BGA Packages Directly Assembled on Boards for Smartphone Applications," Proc.IEEE Electronic Components and Technology Conference (ECTC 2015), IEEE press (2015) p1566.
5. 5. M. Tomikawa, R. Okuda, and H. Ohnishi, J. Photopolym. Sci. Technol., 28, 73 (2015)
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Novel Film Material for RDL Application;Journal of The Japan Institute of Electronics Packaging;2024-08-01
2. Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes;Journal of The Japan Institute of Electronics Packaging;2024-08-01
3. Novel Photo Imageable Film for RDL Application;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides;Macromolecular Rapid Communications;2023-08-31
5. Novel Photosensitive Polyimides Compositions with Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for High Speed Transmission Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3