Highly Reliable Encapsulation Films for OLEDs Composed of SiNx and SiOxCy Prepared Using SWP-CVD

Abstract

We previously succeeded in developing a highly transparent, water impermeable SiNx film for organic light-emitting displays using a surface-wave-plasma enhanced chemical vapor deposition system (SWP-CVD). In this report, we examine multilayer structures consisting of SiNx layers and newly developed SiOxCy layers. The SiOxCy layer could be prepared at a high deposition rate of more than 40 nm/s by a plasma polymerization method using the same SWP-CVD reactor. The SiOxCy layer acts as both a defect decoupling layer and a particle buried layer. A highly reliable barrier performance was realized with the multilayer structure; in the acceleration test of 85°C and 85% relative humidity, the lifetime of the organic light emitting diode with thin-film encapsulation was more than 1,000 h.