Abstract
3D Integration Technology using Thorough Si Via (TSV) is expected as the engine for strengthening of global competitiveness. This technology, as a core technology of More than Moore, that importance has been recognized and the development has been performed all over the world. However, full-scale volume manufacturing is not started yet. In this paper, the history and the latest 3D Integration Technology R&D using TSV in the world are overviewed. Then, the R&D results of Japanese national project "Development on Functionally Innovative 3D-Integrated Circuit (Dream Chip)” and the outline of "Next Generation Smart Device Project" newly started are introduced.
Publisher
The Electrochemical Society
Cited by
2 articles.
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