Author:
Pang Xun,Kriman Alfred M.,Bernstein Gary H.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Semiconductor Industry Association, http://semichips.org/
2. G. H. Bernstein and A. M. Kriman, inEncyclopedia of Electrical and Electronics Engineering, J. Webster, Editor, Vol. 6, p. 514, John Wiley & Sons, New York (1999).
3. Fabrication of microstructures for studies of electromigration in sub-0.25 μm metal interconnections
4. Copper Migration and Precipitate Dissolution in Aluminum/Copper Lines During Electromigration Testing
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