Author:
Tzanavaras Andrew,Young Gregory,Gleixner Stacy
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structures
2. Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films
3. T. Ritzdorf, D. Chen, D. Fulton, and C. Dundas, inIEEE IITC Conference Proceedings, p. 287 (1999).
4. S. H. Brongersma, E. Richard, I. Vervoot, and K. Maex, inIEEE IITC Conference Proceedings, p. 31 (2000).
5. Electroplated Cu Recrystallization in Damascene Structures at Elevated Temperatures
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献