Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology-Reference-Cited by-同舟云学术

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

Published:2006 Issue:3 Volume:153 Page:G223
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Seike Yoshiyuki,Lee Hyo-sang,Takaoka Mineo,Miyachi Keiji,Amari Masahiko,Doi Toshiro,Philipossian Ara

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Y. Seike, S. Kawashima, S. Taniguchi, R. Usui, T. Saito, K. Miyachi, and T. Doi ,Proc. Advance in Abrasive Technology(2000), 197.

2. Y. Seike, S. Kawashima, and K. Miyachi ,Proc. VLSI Multilevel Interconnection Conference(2002), 411.

3. Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Micro-scratches generation mechanism by copper oxides adhered on silica abrasive in copper chemical mechanical polishing;Tribology International;2024-06

2. NOR yield enhancement and downstream process variation reduction by STI CMP optimization;2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2022-05-02

3. The Fuzzy Comprehensive Evaluation of the Self-Conditioning of Hydrophilic Fixed-Abrasive Pad;Advanced Engineering Forum;2018-08

4. Self-conditioning performance of hydrophilic fixed abrasive pad;The International Journal of Advanced Manufacturing Technology;2016-10-11

5. Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation;Journal of The Electrochemical Society;2011