Parametric Study of NiFe and NiFeCo High Density Plasma Etching Using CO / NH 3-Reference-Cited by-同舟云学术

Parametric Study of NiFe and NiFeCo High Density Plasma Etching Using CO / NH 3

Published:1999-06-01 Issue:6 Volume:146 Page:2163-2168
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Jung K. B.¹,Hong J.¹,Cho H.¹,Onishi S.²,Johnson D.²,Park Y. D.¹,Childress J. R.³,Peartona S. J.¹

Affiliation:

1. Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, United States of America

2. Plasma Them Incorporated, St. Petersburg, Florida 33716, United States America

3. IBM Almaden Research Center, San Jose, California 95120, United States of America

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1391907/pdf

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