Annealing Behavior of Reactive Ion Etching Induced Deep Levels
Author:
Affiliation:
1. Microelectronics Center, Department of Electrical and Computer Engineering, New Jersey Institute of Technology, Newark, New Jersey 07102
2. Department of Electrical Engineering, University of Waterloo, Waterloo, Ontario, Canada, N2L 3G1
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/1.2086727/pdf
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2. Application of Selective Liquid‐Phase Deposition to Fabricate Contact Holes Without Plasma Damage;Journal of The Electrochemical Society;1999-06-01
3. Influence of Near-Surface Defects in Si Induced by Reactive Ion Etching on the Electrical Properties of the Pt/n-Si Interface;Japanese Journal of Applied Physics;1997-11-15
4. Effect of dry etching and subsequent annealing of Si/SiGe/Si heterostructure;Journal of Applied Physics;1996
5. HgCdTe Surface Cleanup and Etch Using a Remote Hydrogen Plasma;MRS Proceedings;1994
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