Pinch Off Plasma CVD Deposition Process and Material Technology for Nano-Device Air Gap/Spacer Formation

Author:

Nguyen SonORCID,Haigh T.,Cheng K.,Penny C.,Park C.,Li J.,Mehta S.,Yamashita T.,Jiang L.,Canaperi D.

Funder

IBM Corp

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference31 articles.

1. Cheng K. Park C. Yeung C. Nguyen S. Zhang J. Miao X. Wang M. Mehta S. Li J. Surisetty C. Muthinti R. Liu Z. Tang H. Tsai S. Yamashita T. Bu H. Divakaruni R. , International Electron Device Meeting Proceeding, Vol. 2016, paper 17.1, pp. 444. 2016, San Francisco, USA.

2. Penny C. Gates S. Peethala B. Lee J. Priyadarshini D. Nguyen Son V. McLaughlin P. Liniger E. Hu C.-K. Clevenger L. Hook T. Shobha H. Kerber P. Seshadri I. Chen J. Edelstein D. Quon R. Bonilla G. Paruchuri V. Huang E. , International Interconnect Technology Conference, Proceed. Volume, paper 2.2, May 16–18, 2017, Taipei, Taiwan; and references their in.

3. Nitta S. Ponoth S. Breyetta G. Colburn M. Clevenger L. Horak D. , Advanced Metallization Conference 2007, MRS Proceeding Volume, pp 329.

4. Chen Hsien-Wei , Proceedings of the 11th IITC, pp. 34, Burlingame, CA, June 1–4, (2008).

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