A PEALD Tunnel Dielectric for Three-Dimensional Non-Volatile Charge-Trapping Technology

Author:

Cacciato A.,Breuil L.,Dekker H.,Zahid M.,Kar G. S.,Everaert J.L.,Schoofs G.,Shi X.,Van den bosch G.,Jurczak M.,Debusschere I.,Van Houdt J.,Cockburn Andrew,Date Lucien,Xa Li-Qun,Le Maggie,Lee Won

Abstract

In this paper we compare a novel plasma-enhanced atomic layer deposition (PEALD) oxide with more conventional HTO and ISSG oxides. We show that, remarkably for a deposited oxide, the oxide quality is, both in terms of field-to-breakdown and SILC generation, comparable to that of ISSG thermal oxide. Finally, we show that data retention of SONOS stack with PEALD is significantly better than for stacks with ISSG tunnel oxide. PEALD oxide is, therefore, a promising choice for 3D non-volatile flash technologies.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Hybrid Floating Gate Cell for Sub-20-nm NAND Flash Memory Technology;IEEE Electron Device Letters;2012-03

2. Plasma-Assisted Atomic Layer Deposition: Basics, Opportunities, and Challenges;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2011-09

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