Author:
Kim Soo-Kil,Cho Sung Ki,Kim Jae Jeong,Lee Young-Soo
Publisher
The Electrochemical Society
Subject
Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering
Reference23 articles.
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Advanced Metallization Conference 1999
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3. Development of different copper seed layers with respect to the copper electroplating process
4. Electroplating of Copper Conductive Layer on the Electroless-Plating Copper Seed Layer
5. Electrochemical Deposition of Copper on n‐Si/TiN
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