Author:
Eom Dae-Hong,Kim In-Kwon,Han Ja-Hyung,Park Jin-Goo
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann ,Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York (1997).
2. S. P. Murarka ,Copper—Fundamental Mechanisms for Microelectronic Applications, John Wiley & Sons, New York (2000).
3. M. R. Oliver ,Chemical-Mechanical Planarization of Semiconductor Materials, Springer, Germany (2004).
4. Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures
5. Chemical–mechanical polishing of copper in alkaline media
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