1. Advanced IC packaging for the future applications
2. F. E. Altoz, inElectronic Packaging and Interconnection Handbook, C. A. Harper, Editor, Chap. 2, McGraw-Hill, New York (1997).
3. W. D. Brown, inAdvanced Electronic Packaging, W. D. Brown, Editor, p. 45, IEEE Press Series on Microelectronic Systems, Piscataway, NJ (1999).
4. G. O. Mallory and J. B. Hadju,Electroless Plating: Fundamentals and Applications, American Electroplaters and Surface Finishing Society Press, Orlando, FL (1990).
5. Photoresist channel-constrained deposition of electroless metallization on ligating self-assembled films