1. S. Summerfelt , inThin Film Ferroelectric Materials and Devices, R. Ramesh , Editor, p. 1, Kluwer Academic Publishers, Boston (1997).
2. B. C. Hendrix and G. T. Stauf , inProceedings of the 2000 International Conference on High-Density Interconnect and Systems Packaging, p. 342, International Microelectronics and Packaging Society (2000).
3. Improvement in electrical insulating properties of 10-nm-thick Al2O3 film grown on Al/TiN/Si substrate by remote plasma annealing at low temperatures
4. High-density MIM capacitors using Al2O3 and AlTiOx dielectrics
5. T. Ishikawa, D. Kodama, Y. Matsui, M. Hiratani, T. Furusawa, and D. Hisamoto , Abstract 9.07, IEDM Symposium, IEEE (2002).