Author:
Kim Sunjung,Duquette David J.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. L. J. Loparco and D. J. Duquette , in Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Diectrics, G. S. Mathad , B. C. Baker , C. Reidsema-Simpson , H. S. Rathore , and T. L. Ritzdorf , Editors, PV 2002–22, p. 226, The Electrochemical Society Proceedings Series, Pennington, NJ (2002).
2. Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu-NH[sub 3] Bath
3. Electrochemical Deposition of Copper on n‐Si/TiN
4. Electrodeposition of Copper on Silicon from Sulfate Solution
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