Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application
Author:
Affiliation:
1. State Key Laboratory of Physical Chemistry of Solid Surfaces, and Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen361005, Fujian, China
Funder
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Subject
Renewable Energy, Sustainability and the Environment,General Chemical Engineering,Environmental Chemistry,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acssuschemeng.2c03960
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