Communication—Reduction of Friction Force between Ceria and SiO2for Low Dishing in STI CMP
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference16 articles.
1. CMP Process Control for Advanced CMOS Device Integration
2. Maheran A. A. Menon P. Ahmad I. Yusoff Z. , in Micro and Nanoelectronics (RSM), 2013 IEEE Regional Symposium on, p. 126 (2013).
3. Effects of abrasive particle size and molecular weight of poly(acrylic acid) in ceria slurry on removal selectivity of SiO2/Si3N4 films in shallow trench isolation chemical mechanical planarization
4. Process optimization of dielectrics chemical mechanical planarization processes for ultralarge scale integration multilevel metallization
5. A dishing model for STI CMP process
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