Author:
Zabasajja John,Merchant Tushar,Ng Belinda,Banerjee Suman,Green David,Lawing Scott,Kura Herb
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. J. M. Steigerwald, S. P. Murarka, and R. J. Gutman,Chemical Mechanical Planarization of Microelectronic Materials, p. 1, Wiley & Sons, New York (1997).
2. M. R. Oliver, inChemical Mechanical Polishing: Fundamentals and Challenges, S. V. Babu, S. Danyluk, M. I. Krishnan, and M. Tsujimura, Editors, p. 2.8, Materials Research Society, Warrendale, PA (1999).
3. Von Mises Stress in Chemical‐Mechanical Polishing Processes
4. Tungsten Chemical Mechanical Polishing
5. Pattern Planarization Model of Chemical Mechanical Polishing
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献