Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Holden H. T. Coombs C. F. Jr , Editors, Printed Circuits Handbook, 7th ed., p. 1617, McGraw-Hill Education: New York, Chicago, San Francisco, Athens, London, Madrid, Mexico City, Milan, New Delhi, Singapore, Sydney, Toronto (2016).
2. Kondo K. Akolkar R. N. Barkey D. P. Yokoi M. , Editors, Copper Electrodeposition for Nanofabrication of Electronics Devices, p. 282, Springer-Verlag New York (2014).
3. Kondo K. Kada M. Takahashi K. , Editors, Three-Dimensional Integration of Semiconductors, p. 408, Springer-Verlag New York (2015).
4. Gamburg Y. D. Zangari G. , Theory and Practice of Metal Electrodeposition, p. 378, Springer-Verlag New York (2011).
5. Shacham-Diamand Y. Osaka T. Datta M. Ohba T. , Editors, Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, p. 552, Springer-Verlag New York (2009).
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